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FLIPSTACKCSP中文資料amkor數(shù)據(jù)手冊(cè)PDF規(guī)格書

FLIPSTACKCSP
廠商型號(hào)

FLIPSTACKCSP

功能描述

The FlipStack? CSP family utilizes Amkor’s industry leading ChipArray? Ball Grid Array (CABGA) manufacturing capabilities

文件大小

728.44 Kbytes

頁(yè)面數(shù)量

2 頁(yè)

生產(chǎn)廠商 Amkor Technology
企業(yè)簡(jiǎn)稱

amkor

中文名稱

Amkor Technology官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二到原廠下載

更新時(shí)間

2025-5-24 17:14:00

人工找貨

FLIPSTACKCSP價(jià)格和庫(kù)存,歡迎聯(lián)系客服免費(fèi)人工找貨

FLIPSTACKCSP規(guī)格書詳情

FEATURES

Package height down to 0.6 mm

Design, assembly and test capabilities that enable stacking combinations of memory, logic and mixed signal type devices

Established package infrastructure with standard CABGA and fcCSP footprints

Consistent product performance with high yields and reliability

Die overhang wirebonding

Low loop wirebonding to 40 μm or less

Pb-free, RoHS compliant and green materials

Passive component integration options

JEDEC standard outlines including MO-192, MO-195, MO-216, MO-219 and MO-298

Applications

FlipStack? CSP technology enables smaller, lighter and more innovative new product form factors at a lower cost. This solution address es a range of design requirements, and enables a wide variety of applications, including portable multimedia devices such as tablets, cell phones and digital cameras.

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